Packaging material for electronic components
US5698904A · kind A · utility
9Cited by
4References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 13, 1997 |
| Grant date | Dec 16, 1997 |
| Priority date | — |
| Expiry date | Jan 13, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaging material for electronic components is provided which inhibits the cracking of a passivation film on an encapsulated chip and inhibits the breaking of an interconnecting metallization pattern in a chip of an electronic component and meets the miniaturization trend for electronic components. The packaging material includes: a resin, and 80% to 93% by weight, relative to the total amount of the packaging material, of a filler made up of particles having an average particle size of 30 .mu.m or less, at least 90% by weight of which are spherically shaped or have rounded ends and/or edges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.