Method of treating copper foil for printed circuits
US5700362A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1996 |
| Grant date | Dec 23, 1997 |
| Priority date | — |
| Expiry date | Jun 19, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12792
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A copper foil for printed circuits of which a shiny side has resin dust resistance, excels in heat discoloration resistance and rust preventiveness, and does not adversely affect the solderability and resist adhesion, and a method of treating the surface of such copper foil. The copper foil for a printed circuit comprises a first layer of zinc alloy composed of zinc and nickel and/or cobalt, formed on the shiny side surface of a copper foil, and a second layer composed of a mixture or compound of benzotriazole derivative and phosphorus compound (and silicon compound) formed on the layer. The method for treating the surface of a copper foil for a printed circuit comprises the steps of forming a first layer of zinc alloy composed of zinc and nickel and/or cobalt by electroplating on the shiny side surface of a copper foil, and forming a second layer by immersing it in an aqueous solution of benzotriazole derivative and phosphorus compound (and silicon compound).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.