Etching solution for copper or copper alloy
US5700389A · kind A · utility
24Cited by
5References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 2, 1995 |
| Grant date | Dec 23, 1997 |
| Priority date | — |
| Expiry date | Aug 2, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An etching solution for copper or copper alloys comprising, (a) sulfuric acid, (b) a persulfate, (c) at least one compound selected from imidazole, imidazole derivatives, pyridine derivatives, triazine, and triazine derivatives, and (d) water. The etching solution exhibits a high etching speed and does not oxidize the copper surfaces after etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.