Stackable modules and multimodular assemblies
US5701233A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 1995 |
| Grant date | Dec 23, 1997 |
| Priority date | — |
| Expiry date | Jan 23, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Stacked, multimodular circuit assemblies are provided which comprise stacked, resealable, modules containing electronic circuitry, each module having a plurality of electrically conductive, embedded through-vias between the upper and major surfaces thereof. The through-vias are contained within the module matrix outside of the circuit-containing cavity or "tub" of the module and within the outer edges of the module body. Electronic circuitry contained in the module cavity is electrically connected to the through-vias by signal traces or vias passing out of the cavity and into contact with the through-vias, and adjacent modules are electrically interconnected by a resealable, multichannel connector array between adjacent modules having electrically conductive channels coupling opposing through-vias of the adjacent modules. The connector arrays can also serve to seal the assembly when the entire assemblage of modules is compressed and to connect the stacked modular assembly to exterior circuitry such as a printed circuit board or other device. Methods are also provided for assembling and electrically interconnecting electronic components within such stacked multimodular assemblies by…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.