Ball grid array socket assembly
US5702255A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 1995 |
| Grant date | Dec 30, 1997 |
| Priority date | — |
| Expiry date | Nov 3, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1084
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A ball grid array socket assembly consists of a socket body having a plurality of vias extending through the socket body between upper and lower surfaces thereof, a plurality of electrically conductive contact assemblies respectively disposed in corresponding vias, and a releasable cover assembly. Each of the contact assemblies includes a lower terminal end projecting outwardly from the lower surface of the body for engaging a terminal pad on a circuit board, and further includes an upper multi-fingered contact arrangement for engaging a ball contact of a ball grid array package. Three separate embodiments of the contact assemblies are disclosed. In use, the ball grid array package is received in assembled relation with the socket body adjacent the upper surface thereof wherein the ball contacts of the ball grid array package are received into the vias in engaging electrical communication with the upper contact ends of the contact assemblies. The multi-fingered upper ends of the contact assemblies engage the BGA ball contact at multiple points to reduce creep associated failure of the contact, while a pivoting contact body portion provides relative movement between the BGA contact …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.