Microelectronic device package and method
US5702775A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 1995 |
| Grant date | Dec 30, 1997 |
| Priority date | — |
| Expiry date | Dec 26, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.