Method of manufacturing multilayer array ultrasonic transducers
US5704105A · kind A · utility
51Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 1996 |
| Grant date | Jan 6, 1998 |
| Priority date | — |
| Expiry date | Sep 4, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method for fabricating "1.5D" and "2D" multilayer ultrasonic transducer arrays employs dicing saw kerfs, which provide acoustic isolation between rows. The kerfs are metallized to provide electrical connection between surface electrode layers and buried internal electrode layers. A multilayer piezoceramic transducer element for a "1.5D" or "2D" array produced by this method has higher capacitance, and accordingly provides better transducer sensitivity, in comparison to a single layer element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.