Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet
US5705016A · kind A · utility
49Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 1995 |
| Grant date | Jan 6, 1998 |
| Priority date | — |
| Expiry date | Nov 28, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention disposes an easily releasing layer on a surface intended for dicing tape sticking of a dicing ring frame to thereby enable preventing the transfer of an adhesive substance to the ring frame for use in semiconductor wafer working, reducing the frequency of cleaning of the ring frame to the requisite minimum and prolonging the life of the ring frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.