In-situ coat, bake and cure of dielectric material processing system for semiconductor manufacturing
US5705232A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1994 |
| Grant date | Jan 6, 1998 |
| Priority date | — |
| Expiry date | Sep 20, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02348
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This is a system and method of in-situ coating, baking and curing of dielectric material. The system may include: dispensing apparatus for dispensing spin-on material; a lamp module 50; a window 54 connected to the lamp module 50; an environmental control chamber 56 connected to the window 54; an access gate 60 for wafers 58 in the environmental control chamber 56; a spin chuck 62 inside the environmental control chamber 56; and an exhaust pipe 64 connected to the environmental control chamber 56. The lamp module 50 may contains infra red and ultra violet lamps. In addition, the coating chamber may process dielectric material such as spin-on glass, silicon dioxide and various other spin-on material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.