Phenolic foams having a low formaldehyde evolution
US5705537A · kind A · utility
13Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 1997 |
| Grant date | Jan 6, 1998 |
| Priority date | — |
| Expiry date | Feb 24, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2361/06
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Phenolic foam which can be used as insulation is a foamed phenol-formaldehyde resole resin which contains a peptide, a proteinaceous material, cysteine, glutamic acid, glycine, isoleucine, leucine, lysine, phenylalanine, serine, tryptophan, or mixtures thereof at an amount effective to reduce emission of free formaldehyde from the foamed resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.