Interlayer for ceramic armor
US5705764A · kind A · utility
40Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 1996 |
| Grant date | Jan 6, 1998 |
| Priority date | — |
| Expiry date | May 30, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/911
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention provides an improved method and apparatus for bonding ceramic tiles to armor. The invention uses a toughened epoxy adhesive and a rubber interlayer to improve the bonding of ceramic tile to armor. A scrim cloth is embedded in adhesive layers to serve as a wick and spacer to uniformly distribute the epoxy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.