Power semiconductor module
US5705853A · kind A · utility
60Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1996 |
| Grant date | Jan 6, 1998 |
| Priority date | — |
| Expiry date | Aug 19, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13055
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power semiconductor module is specified in which at least one semiconductor chip, which is fitted on a baseplate, is made contact with by a respective contact plunger. The position of the contact plungers can be set individually in a manner corresponding to a distance between the semiconductor chips and a main connection which accommodates the contact plungers. The contact plungers are either subjected to pressure by means of a spring or fixed by means of a solder layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.