Yeast composition
US5707669A · kind A · utility
4Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1996 |
| Grant date | Jan 13, 1998 |
| Priority date | — |
| Expiry date | Sep 11, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC12N11/04
- WIPO fieldBiotechnology
- WIPO sectorChemistry
Abstract
Encapsulated yeast composition especially developed for use with frozen doughs comprising food grade fibers having adsorbed thereon liquid cream yeast, the particles being coated with a continuous layer of impervious thermoplastic material, frozen dough containing the encapsulated yeast composition and the method for making the encapsulated yeast.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.