Printed circuit board for flow soldering
US5707714A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1996 |
| Grant date | Jan 13, 1998 |
| Priority date | — |
| Expiry date | Sep 13, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved printed circuit board which can reduce or eliminate unsatisfactory soldering caused by trapped gas in surface mounting electronic components by flow soldering is disclosed. According to the invention, the printed circuit board comprises an electrically conductive pattern having a plurality of connection pads to which leads of electronic components are to be connected; and a solder resist layer formed over said electrically conductive pattern and having a plurality of windows which expose said connection pads, wherein at least one of said windows has an extension exposing an additional part of said pad, said extension being substantially narrower than said window. The extension allows the additionally exposed part of the pad to contact with the solder even when the associated pad is almost entirely covered by the trapped gas, so that the solder is pulled to the pad and spread over the pad. Because the extension require a small area, it is effective even when the components are mounted at a high density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.