Method for producing thin film multilayer wiring board
US5707749A · kind A · utility
16Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 1995 |
| Grant date | Jan 13, 1998 |
| Priority date | — |
| Expiry date | Jun 26, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and an adhesive layer on another principal surface. The insulation organic film is a polyimide film having a heat resistance at a pyrolysis beginning temperature of 350.degree. to 550.degree. C., a dielectric constant of 3.5-2.2 and a flame retardance of V-0 or V-1 according to the UL-94 standard. The adhesive layer contains an ether bismaleimide compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.