Photoimageable, dielectric, crosslinkable copolyesters
US5707782A · kind A · utility
10Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 1996 |
| Grant date | Jan 13, 1998 |
| Priority date | — |
| Expiry date | Mar 1, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Photosensitive, dielectric insulating, crosslinkable copolyester films used as dielectric and as photoresist films for microelectronics circuits which are also suitable for use in producing MCM-L packages. In various embodiments of the invention there is provided photosensitive, dielectric insulating, crosslinkable copolyester film forming mixtures for coating onto microelectronics substrate surfaces, a photosensitive oligomer for producing the crosslinkable copolyesters and MCM-L products produced using the crosslinked copolyesters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.