Aqueous coating composition based on low-solvent modified epoxy resin dispersions
US5708058A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1996 |
| Grant date | Jan 13, 1998 |
| Priority date | — |
| Expiry date | Sep 25, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Aqueous low-solvent coating compositions comprising a modified epoxy resin dispersion comprising an epoxy resin which is prepared by condensation of one or more epoxide compounds having at least two epoxide groups per molecule with an aromatic polyol; a dispersant comprising a condensation product of an aliphatic polyol and an epoxide compound having at least two epoxide groups per molecule; a diluent consisting of ethylenically unsaturated otherwise inert or, if desired, functional monomers capable of free-radical polymerization or copolymerization, and water, and also an aqueous curing agent for the modified epoxy resin (I), which is suitable for curing at room temperature or at elevated temperatures (forced drying), components (I) and (II) being employed in proportions by mass such that the ratio of the number of epoxide groups which are capable of reaction to the number of amine hydrogen atoms is between 1:0.75 and 1:2. The coating compositions can be employed to produce matt coatings and in adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.