Integrated electro-optical package and method of fabrication
US5708280A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1996 |
| Grant date | Jan 13, 1998 |
| Priority date | — |
| Expiry date | Jun 21, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02325
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An integrated electro-optical package including a dual sided opto-electronic device, composed of a substrate with an array of light emitting devices (LEDs) formed on a first major surface thereof, and at least one vertical cavity surface emitting laser formed on an opposed second major surface of the substrate. A mounting structure formed so as to allow for the mounting of the dual sided opto-electronic device on the interior major surfaces, and further having electrical conductors for cooperating with the LEDs and VCSEL of the opto-electronic device. A driver substrate having electrical connections for interfacing with the mounting structure and the dual sided opto-electronic device. A plurality of driver circuits connected to the mounting structure and dual sided opto-electronic device through connection pads formed on the driver substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.