Puncture-resistant electrostatic chuck with flat surface and method of making the same
US5708557A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1996 |
| Grant date | Jan 13, 1998 |
| Priority date | — |
| Expiry date | Aug 22, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention includes a puncture-resistant electrostatic chuck with a flat surface and a method of making the same. The electrostatic chuck includes a conductive layer such as copper foil that is laminated to a first insulation layer such as a polyimide. A puncture-resistant layer is placed over the conductive layer and includes random or woven fibers held together by a resin. The puncture-resistant layer has an uneven topography on a top surface due to the fibers contained therein. A second insulation layer overlies the puncture-resistant layer and has a top surface which is substantially flat. The flat top surface of the second insulation layer is made by laminating layers together with a mandrel which is polished and free of irregularities such as pits, dents and high spots. Preferably the mandrel has a uniform thickness over its entire surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.