Solder bonded electronic module
US5708566A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1996 |
| Grant date | Jan 13, 1998 |
| Priority date | — |
| Expiry date | Oct 31, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10969
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic control module (10) includes a circuit substrate (12) containing a plurality of thermal vias (36) and a heat-generating electronic device (26) attached to the thermal vias (36). The circuit substrate (12) is attached to a mounting plate (18) by a plurality of electrically-isolated, thermal attachment pads (20) located at selected positions on an electrically insulating layer (16) overlying a metal baseplate (14). A solder layer (22) functions to both mechanically attach the plurality of thermal vias (36) to the plurality of thermal attachment pads (20), and to provide a thermal dissipation pathway for heat generated by the electronic devices (26). The heat is transferred from the circuit substrate (12) through the plurality of thermal attachment pads (20) to the metal baseplate (14).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.