Desiccant substrate package
US5709065A · kind A · utility
9Cited by
20References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 31, 1996 |
| Grant date | Jan 20, 1998 |
| Priority date | — |
| Expiry date | Jul 31, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D81/266
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A method for protecting substrates used in the manufacture of semiconductors, memory products, and other electronic devices from the effects of moisture during transport and storage is disclosed. This method involves the use of a cassette or box made from polycarbonate or another material having similar hydroscopic properties, treating the cassette or box to reduce its moisture content, and surrounding the cassette or box, and the substrates held therein, with a moisture barrier. This results in a package which will keep the substrates dry and eliminates the need for a separate desiccant within the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.