Apparatus and method for automatic monitoring and control of stencil printing
US5709905A · kind A · utility
32Cited by
11References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 1997 |
| Grant date | Jan 20, 1998 |
| Priority date | — |
| Expiry date | Jan 28, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A stencil printing apparatus (100) is provided for printing a solder paste (108), through apertures (104) in a stencil (102), onto metallized portions of a printed circuit substrate (106). The printing apparatus contains a laser surface profiling device (114) which is used to produce 2- and 3-dimensional profiles of a portion of the surface of solder paste adjacent to a squeegee (110). Data is processed and sent to a controller (118) which is coupled to a solder paste dispenser (112). The controller automatically signals the dispenser (112) to dispense additional solder paste at deficient locations as needed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.