Semi-interpenetrating polymer networks of epoxy and polyolefin resins, methods therefor, and uses thereof
US5709948A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1995 |
| Grant date | Jan 20, 1998 |
| Priority date | — |
| Expiry date | Dec 21, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable composition comprises 0.1 to 50 weight percent of a curable epoxy resin, the weight percent being based on the total resin composition, an effective mount of a curative for the curable epoxy resin, 50 to 99.9 weight percent of at least one of a fully prepolymerized hydrocarbon polyolefin resin and a fully prepolymerized functionalized polyolefin resin, the weight percent being based on the total resin composition, wherein said hydrocarbon polyolefin is present in the range of 25 to 99.9 weight percent of the total resin composition and said functionalized polyolefin is present in the range of 0 to 49.9 weight percent of the total resin composition, said composition being free of epoxidized natural and/or synthetic rubber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.