Extrudable resin for polystyrene and laminate
US5709953A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 1996 |
| Grant date | Jan 20, 1998 |
| Priority date | — |
| Expiry date | Feb 21, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31931
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An extrudable adhesive composition is provided which is useful for bonding a layer of a polystyrene resin to a layer of a second resin. The extrudable adhesive composition comprises PA1 A) an ethylene polymer fraction at between about 35 and about 65 wt percent relative to the total of A) plus B), the ethylene polymer fraction comprising an ethylene polymer, copolymer or mixture of ethylene polymers and copolymers, each ethylene polymer or copolymer being formed from at least about 60 weight percent ethylene monomers, balance other copolymerizable monomers, and the ethylene polymer fraction A) being formed, in total, of at least about 65 weight percent ethylene monomers, balance, other copolymerizable monomers, and PA1 B) between about 35 and about 65 wt %, relative to total of A) plus B), of a styrene/aliphatic/styrene triblock elastomer, between about 20 and about 60 wt % of said triblock elastomer comprising styrene monomers. The MI.sub.2(SB).sup.2 /MI.sub.2(PE) is about 1.0 or above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.