Adhesive composition curable upon exposure to radiation and applications therefor
US5709955A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 1996 |
| Grant date | Jan 20, 1998 |
| Priority date | — |
| Expiry date | Oct 16, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive composition, a laminated structure, and a method of laminating a structure. The adhesive composition comprises an admixture of unsaturated polymerizable material and a photoreactor, the photoreactor comprising a wavelength-specific sensitizer covalently bonded to a reactive species-generating photoinitiator. Suitable wavelength-specific sensitizers have a molar extinction coefficient greater than about 5000 liters per mole per cm at an absorption maximum and resulting photoreactors have a quantum yield of greater than about 0.5 at an absorption maximum. Suitable photoreactors include 2-p-(2-methyllactoyl)phenoxy!ethyl-1,3-dioxo-2-isoindolineacetate, 2-hydroxy-2-methyl-4'-2-p-(3-oxobutyl)phenoxy!ethoxy!propiophenone, 4-p-(4-benzoylcyclohexyl)oxy!phenyl!-2-butanone, and 1,3-dioxo-2-isoindolineacetic acid diester with 2-hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone. The laminated structure includes at least two layers bonded together with the adhesive composition, in which at least one layer is a cellulosic or polyolefin nonwoven web or film. The laminated structure is made by irradiating the adhesive composition to cure the adhesive composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.