Mold compound
US5709960A · kind A · utility
291Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1996 |
| Grant date | Jan 20, 1998 |
| Priority date | — |
| Expiry date | Jun 21, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component has a body (11) that is formed from a mold compound that includes a thermoplastic material (31), a first filler (32) comprised of an electrically insulative material wherein the first filler (32) is more thermally conductive than the thermoplastic material (31), and a second filler (33) comprised of an electrically conductive material wherein the second filler (33) is more thermally conductive than the thermoplastic material (31).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.