Measuring slurry particle size during substrate polishing
US5710069A · kind A · utility
28Cited by
5References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1996 |
| Grant date | Jan 20, 1998 |
| Priority date | — |
| Expiry date | Aug 26, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2015/1447
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of sensing a particle in a mixture includes providing (52) the mixture (36) having a particle (29, 30), moving (54) the mixture (36) in a direction, shining (56) a light into a portion of the moving mixture (36), reflecting a portion of the light off of the particle (29, 30) in the moving mixture (36), detecting and measuring (57) the reflected light, and using (58) the measured reflected light to determine a size of the particle (29, 30).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.