Patent · US Expired

Thermoplastic molding materials based on partly aromatic polyamides and polymethacrylamides

US5710216A · kind A · utility

10Cited by

4References

3Claims

0Family size

Assignee

BASF SE

Inventors

Martin Weber · Maikammer, DE
Herbert Fisch · Monsheim, DE
Gunter Pipper · Bad Dürkheim, DE
Axel Gottschalk · Neustadt, DE

Key dates

Filing date	Dec 14, 1995
Grant date	Jan 20, 1998
Priority date	—
Expiry date	Dec 14, 2015

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L77/06
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Thermoplastic molding materials contain PA1 A) from 1 to 98.5% by weight of a partly aromatic copolyamide, PA1 B) from 1 to 98.5% by weight of a polymethacrylimide, PA1 C) from 0.5 to 30% by weight of a polymeric component having OH groups, PA1 D) from 0 to 60% by weight of fibrous or particulate fillers or mixtures thereof, PA1 E) from 0 to 40% by weight of rubber impact modifiers and PA1 F) from 0 to 40% by weight of conventional additives and processing assistants.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.