Ortho spiroesters and curable and cured resin compositions of same
US5710234A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jan 19, 1996 |
| Grant date | Jan 20, 1998 |
| Priority date | — |
| Expiry date | Jan 19, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0045
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Ortho spiroesters of excellent heat resistance and low volume shrinkage during curing are disclosed. Resin compositions of excellent heat resistance and low curing shrinkage containing these ortho spiroesters are also provided. These photosensitive or heat-curable resin compositions are formulated from photo- or heat-polymerizable compounds containing ethylenic double bonds and carboxyl groups, photopolymerization initiators and sensitizers, or polymerization initiators which generate radicals by heat, and said ortho spiroesters. These resin compositions have low curing shrinkage and are useful for applications requiring dimensional accuracy such as molding materials, encapsulants, adhesives and coatings and also for the preparation of image-forming materials such as protective films for color filters, inks and electrically insulating spacers for touch panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.