Processor-inclusive memory module
US5710733A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1996 |
| Grant date | Jan 20, 1998 |
| Priority date | — |
| Expiry date | Jan 22, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A processor-inclusive memory module (PIMM) is disclosed. In one embodiment of the present invention, the PIMM includes a printed circuit board having first and second opposing surfaces. The printed circuit board also has an address line formed therein. A first SRAM is mounted on the first surface of the printed circuit board. The present PIMM is further comprised of a second SRAM mounted on the second surface of the printed circuit board. The second SRAM is mounted on the second surface of the printed circuit board directly opposite the first SRAM mounted on the first surface of the printed circuit board. The first and second SRAMs are coupled to the address line by respective cache buses. A processor is also mounted on the first surface of the printed circuit board, and is coupled to the address line. In one embodiment of the invention, a heat sink is thermally coupled to the processor. The processor has a plurality of contact pads disposed thereon. Electrical connectors extend from the second surface of the printed circuit board. The electrical connectors are electrically coupled to respective contact pads of the processor. In the present PIMM, the electrical connectors are adapt…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.