Method for manufacturing transducer assembly with curved transducer array
US5711058A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 29, 1995 |
| Grant date | Jan 27, 1998 |
| Priority date | — |
| Expiry date | Dec 29, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A method of manufacturing a transducer assembly having a curved transducer array. The method includes the steps of fabricating a laminated assembly by bonding the following layers together: a layer of electrically conductive, acoustic matching material, a layer of piezoelectric ceramic, a flexible printed circuit board and a layer of acoustic damping material. The acoustic damping material changes from an inflexible state to a flexible state when heated. The laminated assembly is then diced to a depth so that the only undiced portion is a portion of the acoustic damping layer. A core body having a curved front face in the shape of a cylindrical section is fabricated. Then at least the undiced portion of the layer of acoustic damping material is heated into a flexible state. The heated undiced portion of the layer of acoustic damping material is flexed to conform to the curved front face of the core body. Then the flexed undiced portion of the layer of acoustic damping material is bonded to the curved front face of said core body. As a result, the piezoelectric elements are arranged along a curve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.