Method of forming a suspension fabricated from silicon
US5711063A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 1996 |
| Grant date | Jan 27, 1998 |
| Priority date | — |
| Expiry date | Jun 11, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4903
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus comprising a magnetic head suspension assembly (10) comprised of a rectangular portion (12), load beam (14) and flexure (16) fabricated from a silicon structure using the etching techniques of the integrated circuit fabrication industry. Said magnetic head suspension assembly (10) having electrical leads (23) to a slider, a pre-amp circuit (25) and a microactuator (27) fabricated directly thereon. A system of providing a loading force passing to slider (50) comprising either a tapered base plate (40) adapted to be held by a horizontally oriented actuator arm or an actuator arm (60) having at least one angled receiving surface (62,64) for attachment to said suspension assembly. The method of forming a magnetic head suspension assembly (10) from an etched silicon structure comprising a cutting step comprising cutting said silicon structure into the silhouette shape of a magnetic head suspension assembly, having a rectangular portion (12), a load beam (14) and a flexure (16), said flexure being cut in a shape such that finger members (18), slider bond tongue (19) and dimple tongue (20) appear thereon, and subsequent to said cutting step, the step of photo-etching regions …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.