Silicon carbide abrasive wheel
US5711774A · kind A · utility
18Cited by
32References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 9, 1996 |
| Grant date | Jan 27, 1998 |
| Priority date | — |
| Expiry date | Oct 9, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A vitreous bonded abrasive grinding wheel comprises silicon carbide abrasive grain, hollow ceramic spheres and a low temperature, high strength bond. The wheel has improved corner or profile holding characteristics and improved mechanical properties and is suitable for grinding non-ferrous materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.