Cleansing process for wafer handling implements
US5711821A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 1997 |
| Grant date | Jan 27, 1998 |
| Priority date | — |
| Expiry date | Mar 7, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B5/02
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Methods are provided for cleansing contaminants from substrates, such as semiconductor wafer handling implements, and thereby reduce the incidence of contamination of semiconductor devices being assembled upon the semiconductor wafers. In one aspect of the invention, a substrate such as a semiconductor cassette or other semiconductor wafer handling implement, is inserted into a chamber that is substantially isolated from a surrounding environment. A pressurized, and optionally purified, cleansing medium is directed against at least one surface of the substrate to dislodge contaminants from the substrate surface. Dislodged contaminants are evacuated with negative pressure from the chamber. In a preferred aspect of the invention, the cleansing medium is an inert gas, such as nitrogen, and is applied to the substrate at a pressure from about 10 p.s.i. to about 100 or more p.s.i. The chamber can be provided with sidewalls that define a convergent evacuation path that is in fluid communication with an exhaust stream, such as the exhaust stack of the manufacturing facility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.