Method for forming cylindrical lens arrays for solid state imager
US5711890A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 1996 |
| Grant date | Jan 27, 1998 |
| Priority date | — |
| Expiry date | Mar 11, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/413
Abstract
A method of making an imager includes the following steps: providing a semiconductor substrate having a top surface; providing a plurality of spaced image pixels h the substrate, thereby forming a semiconductor portion; and depositing a first transparent substantially inorganic support layer over the semiconductor portion. The method further includes the following steps: making the inorganic support layer optically planar by chemical mechanical polishing, thereby forming an optically flat top surface; forming a plurality of depressions in the optically flat top surface; uniformly depositing a substantially inorganic lens material on the optically flat top surface, entirely filling the depressions; and making the substantially inorganic lens material optically planar by chemical mechanical polishing, thereby forming an optically planar lens surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.