Epoxy adhesives with dithiooxamide adhesion promoters
US5712039A · kind A · utility
17Cited by
31References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1995 |
| Grant date | Jan 27, 1998 |
| Priority date | — |
| Expiry date | Apr 11, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a curable, structural epoxy adhesive composition comprising: (a) an epoxy resin; (b) a curing agent for the epoxy resin; and (c) a compound of the formula I: ##STR1## in which R.sup.1 and R.sup.2, which may be the same or different, are selected from an alkyl group, a hydroxyalkyl group, a cycloalkyl group, an aryl group, an arylalkyl group, or a heterocyclic group in which the one to three non-carbon atoms in the ring are independently selected from S, N, and O.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.