Method for manufacturing printed circuit board
US5712080A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Feb 18, 1997 |
| Grant date | Jan 27, 1998 |
| Priority date | — |
| Expiry date | Feb 18, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing printed circuit board by forming wiring pattern by chemical metal plating using a negative pattern made of a photosensitive resin composition layer as the plating resist, wherein the photosensitive resin comprises at least a linear high polymer composed of repeating units expressed by the following general formula (1); ##STR1## where, R.sub.1 is H, an alkyl group having 1-9 carbon atoms, an alkoxy group having 1-9 carbon atoms, and a carboxyalkyl group having 1-9 carbon atoms, R.sub.2 is an alkylene group having 1-9 carbon atoms, and n is the polymerized number of the repeating unit, and an organic compound expressed by the following general formula (2); ##STR2## where, R.sub.3 is H or an alkyl group having 1-6 carbon atoms, X is NH or S, and Z is N or C--Y, where Y is H, NH.sub.2, or SH.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.