Thin film slider with on-board multi-layer integrated circuit
US5712747A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1996 |
| Grant date | Jan 27, 1998 |
| Priority date | — |
| Expiry date | Jan 24, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49048
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thin film slider with an on-board multi-layer integrated circuit includes a substrate with an air bearing surface and a substantially parallel upper surface spanned by a deposit end. A magnetic head being formed at the deposit end, positioned to magnetically exchange data with a magnetic recording medium that passes beneath the air bearing surface. The upper surface bears an integrated multi-layer accessory circuit, which may be prepared using the CUBE process. Hence, components and vias of the different circuit layers are attached by interconnections that span the edges of the circuit layers. The accessory circuit preferably includes one or more memory devices, such as a cache memory, a DRAM circuit, an EPROM circuit, or another memory circuit appropriate to the application. In embodiments where the magnetic head is a magnetoresistive ("MR") head, the accessory circuit may also include a pre-amplifier and a sensing circuit to support operation of the MR head. The accessory circuit may also include electrostatic discharge ("ESD") protection circuitry to increase the accessory circuit's resistance to damage caused by ESD.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.