Apparatus and method of assembling vehicle instrument panel structural and electronic components
US5712764A · kind A · utility
31Cited by
41References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 1996 |
| Grant date | Jan 27, 1998 |
| Priority date | — |
| Expiry date | May 3, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/59
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus and method of assembling vehicle instrument panel structural and electronic components includes: 1) fabricating an insulative instrument panel base substrate; 2) applying a conductive pattern to the base substrate; and 3) attaching electronic components to the base substrate in electrical communication with the conductive pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.