Electromagnetic interference resistant enclosure panel and method of making the same!
US5713178A · kind A · utility
5Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1996 |
| Grant date | Feb 3, 1998 |
| Priority date | — |
| Expiry date | Jul 1, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0001
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
Electromagnetic interference across a structural panel is minimized in a construction wherein a metal skin (24) is bonded to a metal frame (22) by an adhesive (40) by providing a series of peaks (36) and valleys (38) at the area of the intended joint between the skin (24) and the frame (22). The peaks (36) penetrate through the adhesive (40) to establish substantial electrical contact between the skin (24) and the frame (22) to provide shielding against electromagnetic interference while the adhesive (40) bonds the two together to provide a structurally sound panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.