Embedded heat dissipating device mounting structure
US5713790A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 3, 1996 |
| Grant date | Feb 3, 1998 |
| Priority date | — |
| Expiry date | Sep 3, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20172
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embedded heat dissipating device mounting structure including a housing for an electronic instrument, the housing having an opening and two parallel side boards perpendicularly raised from the periphery of the opening at two opposite sides, a heat dissipating device mounted in the opening of the housing and secured to the parallel side boards and operated to carry heat out of the housing, the heat dissipating device having a cover shell which has backward springy hooks adapted for hooking on the parallel side boards of the housing at an inner side, and elongated flanges adapted for stopping against the parallel side boards of the housing at an outer side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.