Resist material for deletion of coatings
US5713986A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1995 |
| Grant date | Feb 3, 1998 |
| Priority date | — |
| Expiry date | Dec 19, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0076
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a method of forming a desired pattern with a coating on a substrate. The method includes the steps of applying a water soluble resist material in a predetermined pattern to a surface of a substrate, drying the resist material, depositing a coating on the surface of the substrate to form a coated substrate, wherein a portion of the coating overlays the resist material, and dissolving the resist material on the coated substrate with water to remove the resist material and corresponding overlaying coating and form a desired coating pattern on the substrate surface. The dissolving step preferably includes the step of directing high temperature and high pressure water sprays at the surface of the coated substrate to wash off the resist and corresponding overlaying coating. The removal of the resist material may include a prewash operation wherein the surface of the substrate is wetted with water and coating is allowed to soak. The present invention also discloses a resist material for masking selected portions of a glass sheet to form a desired coating pattern. The resist material includes 1-20 wt. % water soluble polymer film former, 0 to 3 wt. % surfacta…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.