Low viscosity hot melt pressure sensitive adhesive compositions
US5714254A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 29, 1997 |
| Grant date | Feb 3, 1998 |
| Priority date | — |
| Expiry date | May 29, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2883
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A low melt viscosity, hot melt pressure sensitive adhesive composition having enhanced tack properties is provided. The composition is based on an S-I-S block copolymer having polystyrene and polyisoprene block segments blended with a petroleum tackifier resin which is a blend of a C.sub.5 -C.sub.9 aromatic modified aliphatic petroleum resin and a hydrogenated, alicyclic monomer containing hydrocarbon resin. The composition optionally also includes a polystyrene-polyisoprene diblock copolymer and a processing oil. The composition may be readily applied as solvent-free melt to various substrates using coating die technology because of its low melt viscosity at coating temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.