Projection exposure apparatus and method which uses multiple diffraction gratings in order to produce a solid state device with fine patterns
US5715039A · kind A · utility
856Cited by
3References
78Claims
0Family size
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Key dates
| Filing date | May 17, 1996 |
| Grant date | Feb 3, 1998 |
| Priority date | — |
| Expiry date | May 17, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70316
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In exposing and projecting a mask onto a substrate using projection optics, a first grating is provided between the substrate and the projection optics and a second grating is provided between the projection optics and the mask so that the image of the mask pattern is formed near the substrate surface by the interference of beams diffracted by the first grating. This arrangement produces the effect of virtually increasing the NA of the optical system by up to a factor of two, making it possible to manufacture LSIs with fine patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.