Overlay substrate for securing electronic devices in a vehicle
US5715140A · kind A · utility
26Cited by
15References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 1996 |
| Grant date | Feb 3, 1998 |
| Priority date | — |
| Expiry date | May 3, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10598
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus is provided for securing electronic devices in a vehicle. A ventilation duct is provided beneath the instrument panel for conveying air in the vehicle. The ventilation duct includes an outer surface. An overlay substrate is laid upon and secured against the outer surface or acts as the wall of the duct, and is adapted for carrying electronic devices thereon. This design improves packaging efficiency within the vehicle. This invention can also be applied to other automotive applications such as on door panels, instrument panels and package trays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.