Impermeable encapsulation of optoelectronic components

US5715338A · kind A · utility

Assignee

• Telefonaktiebolaget LM Ericsson (Publ) · SE

Inventors

• Sven Sjölinder · Stockholm, SE
• Odd Steijer · Bromma, SE
• Goran Palmskog · Järfälla, SE

Key dates

• Filing date: Sep 18, 1996
• Grant date: Feb 3, 1998
• Expiry date: Sep 18, 2016

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/42
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An impermeable encapsulated optocomponent and a method for encapsulating an optocomponent includes providing a base, preferably of silicon, supporting waveguides and an optoelectronic component optically coupled to each other. The optoelectronic component is connected to electric driver circuits. Thereafter a silica layer is deposited over a region of the substrate including at least the coupling of the waveguide and optoelectronic component, after which it is encapsulated by applying a layer of curable plastics material. The deposition of silica provides an impermeable inner encapsulation layer and prevents, when applying the curable plastics material, plastics from penetrating between the inner ends of the waveguides and the optoelectronic component, and thus the optical coupling is secured therebetween.