Method for packaging thermoplastic compositions using a thermally conductive rigid mold
US5715654A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Feb 10, 1998 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0097
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A process of continuously packaging a thermoplastic composition such as a pressure sensitive hot melt adhesive. The method includes the steps of (a) forming a thermoplastic film to a rigid mold wherein said film becomes molten at or below the usage temperature of a hot melt adhesive composition, and the mold is in contact with ambient air; (b) dispensing hot melt adhesive into the lined mold; (c) disposing a thermoplastic film on the surface of the mold to form a packaged hot melt adhesive; (d) allowing the hot melt adhesive to reach a state in the presence of ambient air such that the packaged hot melt adhesive is removable from the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.