Heating furnace
US5716207A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 1996 |
| Grant date | Feb 10, 1998 |
| Priority date | — |
| Expiry date | Jul 26, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67098
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heating furnace and a method for uniformly thermo-setting a paste applied onto the surface of a substrate, and for manufacturing a high quality substrate. The heating furnace can be installed in a small area. A plurality of up-and-down moving pins are provided in a furnace body. The plurality of up-and-down moving pins are penetrating a hot plate having a heater and are vertically movable. A substrate loaded through an opening port in an isolation wall is mounted onto the up-and-down moving pins moved in their upper position. The substrate moved down near the hot plate using the up-and-down moving pins is preheated by the heated hot plate. Then, the substrate is further moved down and vacuum attracted to the hot plate to be heated by the hot plate. After that, the substrate is moved up to the original position and nitrogen gas from nozzles of a gas supply pipe is blown on the surface of the substrate to accelerate cooling of the substrate. After being cooled, the substrate is unloaded through the opening port.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.