Ball grid array including modified hard ball contacts and apparatus for attaching hard ball contacts to a ball grid array
US5716222A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 8, 1996 |
| Grant date | Feb 10, 1998 |
| Priority date | — |
| Expiry date | Aug 8, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1061
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plurality of rigid, generally spherical contact elements are attached to the solder balls of a ball grid array (BGA) package to provide rigid contact points that are suitable for engagement with the contacts of a direct BGA socket assembly. The contact elements include a flattened circumferential surface and a circumferential groove formed in the flattened surface. The circumferential groove divides the contact element into opposing hemispheres. An alignment assembly for aligning the contact elements with the BGA solder ball footprint includes a carrier sheet of electrically insulative, flexible material having a plurality of holes arranged in a predetermined array corresponding to the footprint of solder balls. The contact elements are snap received within the holes of the carrier sheet such that one hemisphere of the contact element is disposed on each side of the carrier sheet. The alignment assembly further includes an alignment fixture for receiving the carrier sheet and BGA package in overlying relation. The alignment fixture includes alignment pins for aligning the carrier sheet in a predetermined position, and alignment arms for aligning the BGA package relative to the ca…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.