Method for removing harmful substances of exhaust gas discharged from semiconductor manufacturing process
US5716428A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 10, 1997 |
| Grant date | Feb 10, 1998 |
| Priority date | — |
| Expiry date | Feb 10, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S261/54
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method for removing harmful substances of an exhaust gas discharged from a semiconductor manufacturing process. The method includes the steps of: removing at least one of a water-soluble component, a hydrolyzable component and dust contained in the exhaust gas discharged from semiconductor manufacturing equipment by water scrubbing; heating the water-scrubbed exhaust gas to thermally decompose a thermally-decomposable component contained therein and removing dust generated by the thermal decomposition from the thermally-decomposed exhaust gas by water scrubbing to render the thermally decomposed exhaust gas into a clean exhaust gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.